cpomaemКоррозия: защита материалов и методы исследованийTitle in englishИФХЭ РАН10.61852/2949-3412-2024-2-2-95-107cpomaem-58Research ArticleСтатьиРост анодных пленок на меди и особенности адсорбции на них 5-трифторметил-3-амино-1,2,4-триазолаGrowth of anode films on copper and features of adsorption of 5-triflouromethyl-3-amino-1,2,4-triazole on themАгафонкинаМ. О.AgafonkinaM. O.

Ленинский просп.31, корп. 4, Москва, 119071

Leninsky pr. 31, 119071 Moscow

agafonkina@inbox.ruАндрееваН. П.AndreevaN. P.

Ленинский просп.31, корп. 4, Москва, 119071

Leninsky pr. 31, 119071 Moscow

Институт физической химии и электрохимии им. А.Н. Фрумкина Российской академии наук (ИФХЭ РАН)РоссияA.N. Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of SciencesRussian Federation2024250620240295107Copyright © Агафонкина М.О., Андреева Н.П., 20242024Агафонкина М.О., Андреева Н.П.Agafonkina M.O., Andreeva N.P.This work is licensed under a Creative Commons Attribution 4.0 License.https://www.cpmrm.ru/jour/article/view/58

Изучено адсорбционное и пассивирующее действие 3-амино-1,2,4-триазола (3-АТ) и 5-CF3-3-амино-1,2,4-триазола (ТФАТ) на меди в нейтральном боратном буферном растворе. Оба соединения хемосорбируются на окисленной поверхности меди при потенциале E=0,0 В (н.в.э.) с величинами свободных энергий адсорбции 57,7 и 96,6 кДж/моль для 3-АТ и ТФАТ, соответственно. Эллипсометрическим методом подтвердили образование комплекса Cu(I)-ТФАТ, обнаруженного ранее методами рентгенофотоэлектронной и Оже-спектроскопии. Толщина комплекса Cu(I)-ТФАТ за 220 мин окисления при E=0,35 В достигает ≈4 нм.

The adsorption and passivation effect of 3-amino-1,2,4-triazole (3-AT) and 5-CF3-3-amino-1,2,4-triazole (TFAT) on copper in a neutral buffer solution was studied. Both compounds are chemisorbed on the oxidized copper surface at a potential E=0 V with adsorption free energies of 57,7 and 96,6 kJ/mol for 3-AT and TFAT, respectively. The ellipsometric method confirmed the formation of the Cu(I)-TFAT complex, previously discovered by XPS and OES. The thickness of the Cu(I)-TFAT complex reaches ≈4 nm after 220 min of oxidation at E=0,35 V.

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The authors declare that there are no conflicts of interest present.