Application of Ellipsometry to Study Adsorption of Organic Additives on Copper in Copper Sulfate Plating Electrolytes
https://doi.org/10.61852/2949-3412-2025-3-1-164-171
Abstract
The mutual influence of different functional organic additives in sulfate electrolyte of copper plating during co-adsorption on the surface of copper cathode was investigated by ellipsometric method. The work studies the kinetics of adsorption on a copper electrode from a sulfate solution of three-component mixtures composed of organic additives (Inhibitors) – PEG-8000 and PEG-115, (Leveler) – Janus green B (YaZ), (Brightener) – Avangard and AFDS (bis(2-aminophenyl) disulfide), which has a disulfide bond in its structure, using the ellipsometric method. It is shown that the introduction of AFDS into the three-component mixture a more stimulating effect of APhDS addition on adsorption was observed instead of Avangard of the mixture.
About the Authors
N. P. Andreeva
Frumkin Institute of Physical Chemistry and Electrochemistry Russian Academy of Sciences
Russian Federation
Russian Federation
31-4, Leninsky prospect, 119071 Moscow
I. A. Kuznetsov
Frumkin Institute of Physical Chemistry and Electrochemistry Russian Academy of Sciences
Russian Federation
Russian Federation
31-4, Leninsky prospect, 119071 Moscow
V. A. Polikarchuk
Voronezh State University
Russian Federation
Russian Federation
394018, Voronezh, University Square, 1
N. V. Sotskaya
Voronezh State University
Russian Federation
Russian Federation
394018, Voronezh, University Square, 1
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Review
For citations:
Andreeva N.P., Kuznetsov I.A., Polikarchuk V.A., Sotskaya N.V. Application of Ellipsometry to Study Adsorption of Organic Additives on Copper in Copper Sulfate Plating Electrolytes. Title in english. 2025;(1):164-171. (In Russ.) https://doi.org/10.61852/2949-3412-2025-3-1-164-171
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