The effect of N- and S-containing organic compounds on the process of copper electrodeposition and mycological resistance of the coatings obtained
https://doi.org/10.61852/2949-3412-2025-3-4-17-34
Abstract
The effect of rhodanine on hydrogen embrittlement during the electrodeposition of copper from an ethylenediamine electrolyte and the corrosion destruction of the resulting copper coatings under the action of Aspergillus niger and Penicillium chrysogenum has been studied. The introduction of rhodanine into the electrolyte makes it possible to increase the current efficiency of copper, improve the protective qualities of the coating and reduce hydrogenation of electrical components, which will increase their reliability and durability. The effectiveness of the introduction of rhodanine into an ethylenediamine copper electrolyte at a concentration of 5 mmol/L as an inhibitor and hydrogenation during electrodeposition of steel and micromycete corrosion under the action of Aspergillus niger and Penicillium chrysogenum has been established.
About the Authors
A. A. Mikheeva
Frumkin Institute of Physical Chemistry and Electrochemistry Russian Academy of Sciences
Russian Federation
Russian Federation
31-4, Leninsky prospect, 119071 Moscow
M. A. Agievich
Frumkin Institute of Physical Chemistry and Electrochemistry Russian Academy of Sciences
Russian Federation
Russian Federation
31-4, Leninsky prospect, 119071 Moscow
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For citations:
Mikheeva A.A., Agievich M.A. The effect of N- and S-containing organic compounds on the process of copper electrodeposition and mycological resistance of the coatings obtained. Title in english. 2025;(4):17-34. (In Russ.) https://doi.org/10.61852/2949-3412-2025-3-4-17-34
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