Growth of anode films on copper and features of adsorption of 5-triflouromethyl-3-amino-1,2,4-triazole on them
https://doi.org/10.61852/2949-3412-2024-2-2-95-107
Abstract
The adsorption and passivation effect of 3-amino-1,2,4-triazole (3-AT) and 5-CF3-3-amino-1,2,4-triazole (TFAT) on copper in a neutral buffer solution was studied. Both compounds are chemisorbed on the oxidized copper surface at a potential E=0 V with adsorption free energies of 57,7 and 96,6 kJ/mol for 3-AT and TFAT, respectively. The ellipsometric method confirmed the formation of the Cu(I)-TFAT complex, previously discovered by XPS and OES. The thickness of the Cu(I)-TFAT complex reaches ≈4 nm after 220 min of oxidation at E=0,35 V.
About the Authors
M. O. Agafonkina
A.N. Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences
Russian Federation
Russian Federation
Leninsky pr. 31, 119071 Moscow
N. P. Andreeva
A.N. Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences
Russian Federation
Russian Federation
Leninsky pr. 31, 119071 Moscow
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For citations:
Agafonkina M.O., Andreeva N.P. Growth of anode films on copper and features of adsorption of 5-triflouromethyl-3-amino-1,2,4-triazole on them. Title in english. 2024;(2):95-107. (In Russ.) https://doi.org/10.61852/2949-3412-2024-2-2-95-107
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